Market Insights - Q4 2023 - New Design - Flipbook - Page 13
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Analog Devices
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Evonetix announces a joint development agreement and commercial supply agreement with Analog Devices, Inc. (ADI) to
advance their semiconductor-based gene synthesis platform, aiming to revolutionize current gene synthesis approaches and
accelerate the design-build-test cycle for biologic therapies, potentially increasing gene delivery productivity by up to 10-fold.
Analog Devices (ADI) is set to debut at Industrial Transformation ASIA-PACIFIC 2023, showcasing innovative solutions for
sustainable
practices, including energy and industry automation solutions, with key highlights like the OtoSense Smart Motor Sensor and
Trinamic motor control products, while also serving as the Platinum Sponsor for the event.
Analog Devices, Inc. faces short-and long-term concerns despite an exceptional growth track record, with declining markets
and a planned cut in investment, reflected in rising inventories and a dip in accounts receivable, raising worries about
accelerated share buybacks at high valuations and potential value destruction at the end of a successful growth cycle.
Broadcom
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Broadcom Inc., a major chip supplier for Apple and other tech giants, anticipates AI computing expansion to offset its recent
slowdown, with networking semiconductors supporting AI systems expected to constitute over 25% of total chip sales in fiscal
2024; while the company's overall sales growth is slowing, CEO Hock Tan is optimistic about the AI sector's potential and the
growth in computer network spending to support AI services.
Semiconductor giant Broadcom, after its $69 billion acquisition of VMware, is relocating its San Jose headquarters to the 1.6
million-square-foot campus in Palo Alto acquired in the deal, with CEO Hock Tan emphasizing a return-to-office policy for
employees, citing that "remote work does not exist at Broadcom," and plans to consolidate former VMware employees into its
operations while issuing WARN notifications for impending layoffs in multiple states.
Infineon
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Infineon reports better-than-expected 2023 revenue of €16.31 billion ($17.72 billion), up 15% from the previous year, driven by
strong demand for semiconductors in the electromobility and renewable energy sectors, with CEO Jochen Hanebeck
highlighting unabated growth in these areas, while forecasting slightly slower revenue growth of €17 billion for the 2024
fiscal year.
Infineon has officially closed its acquisition of GaN Systems for $830 million, consolidating its power components position in
high- growth markets such as automotive, motor control, and green industrial power; Infineon's focus on energy efficiency is
expected to benefit from GaN Systems' E-HEMT technology, which allows for higher switching speeds and higher power
densities.
Hyundai and Kia have entered a strategic collaboration with Infineon Technologies to advance the power performance of
their upcoming electric and hybrid models, aiming to procure a portion of power semiconductors from Infineon by 2030, as
the companies plan to increase their annual electric car production from 600,000 to 3.6 million units by 2030.
Intel
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At the IEEE International Electron Devices Meeting 2023, Intel showcased significant breakthroughs in transistor scaling,
presenting advancements in 3D stacked CMOS transistors with backside power and direct backside contacts, incorporating
gallium nitride (GaN) transistors on a single wafer, and demonstrating prototypes of high-mobility transition metal
dichalcogenide transistors, all contributing to the ongoing evolution of Moore's Law and high-performance computing
demand.
Intel accused AMD of "selling half-truths to unsuspecting customers" in a now-deleted presentation, focusing on the confusing
naming
of AMD's Ryzen 7000 series mobile processors, particularly the Ryzen 5 7520U based on the older Zen 2 architecture, and
likening AMD's naming scheme to selling "snake oil." Intel's attack comes amid its own history of confusing processor naming
schemes and architectures and follows its recent launch of 14th Gen desktop processors that critics argue lack significant
architecture changes from the 13th Gen.
Intel and Siemens have entered a memorandum of understanding (MoU) to collaborate on enhancing the digitalization and
sustainability of microelectronics manufacturing, focusing on areas like energy management optimization, carbon footprint
reduction, and utilizing "digital twins" for complex manufacturing facilities.
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